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(footprint "TP25_VIA"
(version 20241229)
(generator "pcbnew")
(generator_version "9.0")
(layer "F.Cu")
(descr "25 MIL ROUND TP")
(property "Reference" "REF**"
(at 0 -1.0175 0)
(layer "F.SilkS")
(uuid "9c60904a-6559-4543-b295-e9d589d20daa")
(effects
(font
(size 1 1)
(thickness 0.15)
)
)
)
(property "Value" "TP25_VIA"
(at 0 1.0175 0)
(layer "F.Fab")
(uuid "313cdccf-688c-463e-a0f0-a2fc3c858563")
(effects
(font
(size 1 1)
(thickness 0.15)
)
)
)
(property "Datasheet" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "5554d677-0640-4620-8b42-40ef24d542a3")
(effects
(font
(size 1 1)
(thickness 0.15)
)
)
)
(property "Description" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "c1595a9c-6539-41ee-95a1-c173c1a779f9")
(effects
(font
(size 1 1)
(thickness 0.15)
)
)
)
(pad "1" thru_hole circle
(at 0 0)
(size 0.635 0.635)
(drill 0.2)
(layers "*.Cu" "*.Mask")
(remove_unused_layers no)
(solder_paste_margin -2147.48364)
(thermal_bridge_angle 90)
(uuid "553ad029-b712-4b13-9aaa-b04d23555447")
)
(embedded_fonts no)
)
|
